SMD Hot Air Rework Station SBK858 เครื่องเป่าลมร้อนถอดซิพ

Description

Details

DESCRIPTIONS:

Suitable for SOIC, QFP, PLCC, BGA, SMC and temperature-sensitive components. Work great for desoldering surface mount components in the circuit board of mobile phone. Suitable for heating shrink, drying, lacquer removal, viscidity removal, ice-out, pre-heating etc.

SPECICATIONS:

Input Voltage	AC220V 50HZ/AC110V 60HZ
Temp. Range	100~450°C
Max.Power Rating	700W
Air Blowing Device	build-in pump
Air Flow	23L/Min
Dimensions	(L)160x(W)95x(H)141mm
Length of the cord	1.2m
Heating Element	BK853
Nozzle C/W machine	A1124,A1130

FEATURES:

Hot air temperature and volume adjustable,ideal for QFP,SOP,PLLCC and SOJ chips removing.
Built-in sensor ensures stable temperature output
Pulses heating method,protect heating element,hot air blower from overheating,thus prolongs the machine's service life.
ESD safe design,no damage will caused to sensitive components
Automatic cool off system,protect the heater from overheating.
Intelligent air volume and temp. saving function available
When not in use,auto cooling mode will be initiated by putting handle on the stand

REPLACEMENTS: